Sputtering is a form of physical vapor deposition (PVD). Sputtering is a physical process where argon ions bombard the surface of a “target.” The target material is ejected from the target surface and travels under a vacuum to create a film on the surface of a substrate. Most materials can be sputtered, including conductors, insulators, and semiconductors. Sputtering creates thin films, less than one micrometer thick on the sample surface.
Four magnetron sputter sources
Six-inch diameter maximum substrate size
Pre-sputter clean for removal of native oxide on sample surface
Co-sputter from multiple targets