Nanofabrication Facility

SUSS MicroTec MA/BA6 Mask Alignment System

As a key part of the photolithography process, the Mask Aligner can perform the precise alignment of photomask and substrate that is needed for creation of microscale structures. 

Topside alignment and backside alignment

Substrate sizes from 1” to 150mm diameter

Mask sizes from 2.5” X 2.5” to 7” X 7”

10mm maximum substrate thickness

For use with i-line resists